Shenzhen Danbond Technology Co.,Ltd. engages in the research, development, manufacture, and sale of flexible circuits and its materials primarily in China. The company offers FCCL single and double side substrates used in LCD monitors, LCD TVs, cameras, mobile phones, netbooks, e-books, cars, etc.; COF flexible encapsulation substrates; chip on flexible printed circuit products used in LCD TVs, smart 3G phones and laptop computers, and other products with LCD display drivers; and flexible printed circuit boards. It also provides encapsulation-related heat curing adhesive and micro adhesive glue films. The company was founded in 2001 and is based in Shenzhen, China. Shenzhen Danbond Technology Co.,Ltd. is a subsidiary of Shenzhen Danbang Investment Group Co., Ltd.
Research context
Shenzhen Danbond Technology Co.,Ltd appears in PyInvesting’s Shenzhen Stock catalogue. The price history above describes this recorded instrument; it does not by itself identify a company’s business or establish a continuous investment return.
- Currency
- CNY
- Sector
- Technology
- Industry
- Electronic Components
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5 years, 6 months ago
Shenzhen Danbond Technology Co.,Ltd is currently in a long term downtrend where the price is trading 34.6% below its 200 day moving average.
From a valuation standpoint, the stock is 2.0% more expensive than other stocks from the Technology sector with a price to sales ratio of 8.2.
Shenzhen Danbond Technology Co.,Ltd's total revenue rose by 1.3% to $107M since the same quarter in the previous year.
Its net income has dropped by 162.0% to $-6M since the same quarter in the previous year.
Finally, its free cash flow grew by 91.6% to $-1M since the same quarter in the previous year.
Based on the above factors, Shenzhen Danbond Technology Co.,Ltd gets an overall score of 2/5.