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China Wafer Level CSP Co., Ltd is currently in a long term downtrend where the price is trading 15.7% below its 200 day moving average.
From a valuation standpoint, the stock is 142.6% more expensive than other stocks from the Technology sector with a price to sales ratio of 19.5.
China Wafer Level CSP Co., Ltd's total revenue rose by 54.9% to $339M since the same quarter in the previous year.
Its net income has increased by 101.3% to $113M since the same quarter in the previous year.
Finally, its free cash flow grew by 407.4% to $165M since the same quarter in the previous year.
Based on the above factors, China Wafer Level CSP Co., Ltd gets an overall score of 3/5.
| Exchange | SHG |
|---|---|
| CurrencyCode | CNY |
| ISIN | CNE100001SM0 |
| Sector | Technology |
| Industry | Semiconductors |
| Beta | 0.47 |
|---|---|
| Market Cap | 18B |
| PE Ratio | 70.46 |
| Target Price | 26.7 |
| Dividend Yield | 0.2% |
China Wafer Level CSP Co., Ltd. provides wafer level miniaturization technologies and processes for the electronics industry. It offers CIS chips, TOF chips, image sensor chips, biometric identification chips, and MEMS chips and related products are widely used in smart phones, security monitoring digital, automotive electronics, identification, and other fields. The company also provides design, test, and logistics solutions, including design chain management; design for manufacturing; design for cost; full design and verification of WL, leadframe, laminate, etc.; electrical, thermal, and mechanical characterization; and quick turn prototype services. In addition, it offers assembly services, such as turnkey solutions for TSV, wire bond, and flip chip; high-volume manufacturing; wafer finishing and 2/3D assembly; wafer to wafer and die to wafer bonding; micro-joining; integrated and SMT passives; and FA and reliability testing services comprising package and board level, bump reliability, underfill/EMC adhesion, drop and bend tests, solder joint reliability prediction, materials lab, and failure analysis. The company serves consumer, computing, communication, and medical markets. China Wafer Level CSP Co., Ltd. was founded in 2005 and is headquartered in Suzhou, China.
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