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1 Comment
C.Uyemura & Co.,Ltd is currently in a long term uptrend where the price is trading 21.7% above its 200 day moving average.
From a valuation standpoint, the stock is 58.8% more expensive than other stocks from the Basic Materials sector with a price to sales ratio of 1.2.
C.Uyemura & Co.,Ltd's total revenue rose by 8.6% to $14B since the same quarter in the previous year.
Its net income has increased by 40.8% to $2B since the same quarter in the previous year.
Based on the above factors, C.Uyemura & Co.,Ltd gets an overall score of 3/5.
| CurrencyCode | JPY |
|---|---|
| Exchange | TSE |
| Industry | Specialty Chemicals |
| Sector | Basic Materials |
| ISIN | JP3155350006 |
| Target Price | 15750 |
|---|---|
| Dividend Yield | 1.9% |
| Market Cap | 233B |
| PE Ratio | 16.41 |
| Beta | 0.88 |
C.Uyemura & Co.,Ltd., together with its subsidiaries, engages in the research, development, manufacture, and sale of surface treatment chemicals and machinery in Japan, Taiwan, China, and internationally. It operates through Surface Finishing Materials Business, Surface Finishing Machinery Business, Plating Job Business, Real Estate Rental Business, and Other segments. The company offers plating chemicals and machines for printed wiring boards and aluminum magnetic disks, industrial chemicals, and non-ferrous metals. It also provides electronic circuit boards, including package boards, rigid and flexible printed wiring boards, plating equipment, and plating solution control systems; semiconductors, such as logic and memory devices; electric components comprising connectors, passive devices, and power devices; and functional plating, which includes pre-treatment, composite and nickel plating, and plating solution control systems. In addition, the company offers copper plating, final finish, electroless plating, and hard disk media Ni-P plating processes, as well as electrolytic plating process for bump formation; chemical pre and post treatment, and stripper, as well as chromium, zinc, tin and tin alloy, gold, silver, and palladium plating; polishing compounds solutions, such as solid and liquid buffing, and barrell, as well as polishing equipment; and surface finishing systems. Further, it is involved in the leasing of office buildings, apartment houses, and factory land. C.Uyemura & Co.,Ltd. was founded in 1848 and is headquartered in Osaka, Japan.
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