JCET Group Co., Ltd

JCET Group Co., Ltd., together with its subsidiaries, provides integrated-circuit manufacturing and technology services in China and internationally. The company offers semiconductor package integration design, wafer probing, bumping, assembly, final testing, and global drop shipment solutions; wafer level and fan out packaging, system-in-packaging, flip chip packaging, wirebond packaging, and MEMS and sensor packaging; and flip chip and wire bonding products. It also provides design and characterization, wafer bumping, packaging, test, and reliability test and failure analysis services. The company's products are used in the automotive, artificial intelligence, computing, storage, communication, smart device, industrial, medical, power, and energy industries. In addition, it is also involved in industrial investment, wastewater treatment, and trading activities. The company was formerly known as Jiangsu Changjiang Electronics Technology Co., Ltd. and changed its name to JCET Group Co., Ltd. in November 2019. JCET Group Co., Ltd. was founded in 1972 and is based in Jiangyin City, China.